Maintenance Parts Pro is pleased to offer procurement options for Hittite Microwave Corporation part number HMC241QS16, a Microcircuit Linear product we carry that is listed with the NSN 5962-01-576-5546 for seamless identification. As this item is available for purchase today, be sure to fill out and submit the Request for Quote (RFQ) form on this page if you are interested in obtaining pricing information. All that we ask is that you share details like your budget, desired quantity, and expected fulfillment speed so that we can respond with the most fitting solutions for your comparisons.
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Alongside streamlined quotation processes, we aim to support our customers by providing as much relevant listing information and data with product offerings as possible. For example, part number HMC241QS16 specifically traces back to Hittite Microwave Corporation through CAGE Code 1CN88, as well as belongs to the FSC [FSC] as per its NSN of 5962-01-576-5546. Referencing such details, you can locate and procure exact specifications with ease. With our various practices in mind, do not hesitate to request a quote on part number HMC241QS16 using our provided form.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-576-5546 Item PartTypeName: MICROCIRCUIT,LINEAR | 5962 | 015765546 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
91793093 | 5 | 9 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
CXCY | Part Name Assigned By Controlling Agency | GAAS MMIC SP4T NON-REFLECTIVE SWITCH, DC-3.5 GHZ |
FEAT | Special Features | PACKAGE BODY MATERIAL, LOW STRESS INJECTION MOLDED PLASTIC SILICA AND SILICON IMPREGNATED; LEADFRAME PLATING, SN PB SOLDER; MSL RATING, MSL1 (1); STORAGE TEMPERATURE, -65 TO POSITIVE 150 DEGREES C; OPERATING TEMPERATURE, -40 TO POSITIVE 85 DEGREES C; NOTES, LEADFRAME MATERIAL-COPPER ALLOY; DIMENSIONS ARE IN INCHES (MILLIMETERS); DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15MM PER SIDE; DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25MM PER SIDE; ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND |
MRC | Decoded Requirement | Clear Text Reply |
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