Maintenance Parts Pro is pleased to offer procurement options for Dpac Technologies Corp part number 205-0059-001, a Microcircuitassembly product we carry that is listed with the NSN 5962-01-356-6553 for seamless identification. As this item is available for purchase today, be sure to fill out and submit the Request for Quote (RFQ) form on this page if you are interested in obtaining pricing information. All that we ask is that you share details like your budget, desired quantity, and expected fulfillment speed so that we can respond with the most fitting solutions for your comparisons.
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Alongside streamlined quotation processes, we aim to support our customers by providing as much relevant listing information and data with product offerings as possible. For example, part number 205-0059-001 specifically traces back to Dpac Technologies Corp through CAGE Code 66847, as well as belongs to the FSC [FSC] as per its NSN of 5962-01-356-6553. Referencing such details, you can locate and procure exact specifications with ease. With our various practices in mind, do not hesitate to request a quote on part number 205-0059-001 using our provided form.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-356-6553 Item PartTypeName: MICROCIRCUIT ASSEMBLY | 5962 | 013566553 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
7 | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
DPS 1X16-RB | 5 | 2 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
FEAT | SPECIAL FEATURES | NUCLEAR HARDNESS CRITICAL ITEMS |
NHCF | NUCLEAR HARDNESS CRITICAL FEATURE | HARDENED |
TTQY | TERMINAL TYPE AND QUANTITY | 31 PIN |
ADAU | BODY HEIGHT | 0.170 INCHES NOMINAL |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND RADIATION HARDENED AND STATIC OPERATION |
ADAQ | BODY LENGTH | 0.999 INCHES NOMINAL |
ADAT | BODY WIDTH | 0.999 INCHES NOMINAL |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CZEM | MICROCIRCUIT DEVICE TYPE AND QUANTITY | 4 MEMORY |
CZER | MEMORY DEVICE TYPE | RAM |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
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